This volume focuses on a variety of novel non-destructive techniques for the characterization of materials, processes and devices. Emphasis is placed on probe-specimen interactions, in-situ diagnosis, instrumentation developments and future trends. This was the first time a symposium on this topic had been held, making the response particularly gratifying. The high quality of the contributions are a clear indication that non-destructive materials characterization is becoming a dynamic research area in Europe at the present time. A selection of contents: The role of acoustic properties in designs of acoustic and optical fibers (C.K. Jen) Observation of stable crack growth in Al 2 O 3 ceramics using a scanning acoustic microscope (A. Quinten, W. Arnold). Mechanical characterization by acoustic techniques of SIC chemical vapour deposited thin films (J.M. Saurel et al). Efficient generation of acoustic pressure waves by short laser pulses (S. Fassbender et al). Use of scanning electron acoustic microscopy for the analysis of III-V compound devices (J.F. Bresse). Waves and vibrations in periodic piezoelectric composite materials (B.A. Auld). Precision ultrasonic velocity measurements for the study of the low temperature acoustic properties in defective materials (A. Vanelstraete, C. Laermans). Thermally induced concentration wave imaging (P. Korpiun et al). Interferometric measurement of thermal expansion (V. Kurzmann et al). Quantitative analyses of power loss mechanisms in semiconductor devices by thermal wave calorimetry (B. Buchner et al). Thermal wave probing of the optical electronic and thermal properties of semiconductors (D. Fournier, A. Boccara). Thermal wave measurements in ion-implanted silicon (G. Queirola et al). Optical-thermal non-destructive examination of surface coatings (R.E. Imhof et al). Bonding analysis of layered materials by photothermal radiometry (M. Heuret et al). Thermal non-linearities